Jaro Thermal's 'NEON-SINK' Is Super Cool

The synergistic marriage of fan to 'open fin' heat sink dissipates .275 watts / degrees C. Due to a unique, synergistic marriage of fan to 'open fin' heat sink, the Neon series dissipates .275 watts / degrees C. This results in an exceptionally low thermal resistance.

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JaroThermal's THIN 'Ultra-High-Speed' Turbo Fans

Provides 174 CFM of chilly-cold air in a 'conveniently thin' 25mm design! The new 'pancake' fan utilizes aerodynamic blades, which are specifically designed and angled to maximize static pressure. At the same time, a slick air-gliding frame adds additional air flow - to create this super-cooling fan.

Key features include:

• Optimal cooling performance.
• Low vibration
• Low noise due to a unique blade design
• Ultra-low power consumption
• Low-profile
• Thermal sensor or TAC output signal available.
• Board Mountable

Please refer to www.jarothermal.com for more information about Jaro Thermal's cooling technology.

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	Aavid’s Stampings for LED footprints up to 34 x 34mm Features & Benefits • Lightweight • Variety of fin configurations • Low Cost • Requires minimal structural support • Use with natural or forced convection airflow • Can support high volume production
Aavid’s Pin Fin for LED footprints up to 40 x 40mm Features & Benefits • Fin array allows airflow in any direction • Compact size • Available with pre-applied thermal tape • Excellent forced convection cooling • Reduced space requirement • Simple assembly • Cost effective
	Aavid’s Extrusions for LED footprints 40mm and above Features & Benefits • Highly configurable • Low Thermal Resistance • Can incorporate structural and aesthetic elements • Cools multiple devices
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Bond Adhesives & LEDs Thermal Clad Substrates W/ Pre-Applied Thermal Interface Thermal Clad Substrate Materials Go back                                 Light Emitting Diodes (LEDs) have been around for years, primarily concentrated in such markets as cell phones, PDAs and other consumer electronics. Today, as technological advancements in LED design and processes are continually boosting light output to rival incandescent, fluorescent, and even halogen light sources, the need to protect the LEDs against heat build-up is greater than ever before.
	Bond-Ply® Adhesive Bond-Ply is a thermally conductive, pressure sensitive adhesive tape, available in either fiberglass reinforced or unreinforced. With its ability to have high bond strength, it can eliminate the need for screws, clip mounts or fasteners. • Good thermal performance • Immediately bonds to target surface • Eliminates need for mechanical fasteners or screws • Alternative to heat-cure adhesives
Liqui-Bond® Adhesive Liqui-Bond is a thermally conductive liquid silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond features excellent low and high-temperature mechanical and chemical stability. It can be supplied in either a tube or mid-sized container form. • High thermal conductivity • Easy dispensing • Can achieve a very thin bond line • Heat cure
Thermal Clad Substrates W/ Pre-Applied Thermal Interface Thermal Clad Substrate Materials Go back

OPTEK understands every aspect of thermal management for your solid state lighting. We have the tools and expertise in-house to design the right thermal management system to ensure your solid state lighting performs at optimum levels for years to come.

Junction temperature directly affects the performance, reliability and life of LEDs in the following ways:

• Reduced output power
• Reduced forward voltage
• Shifted dominant wavelength
• Shifted color temperature
• Reduced MTTF and accelerated degradation

The junction temperature depends on three factors:

• Power dissipation
• Thermal resistances of the substrate and assembly
• Ambient conditions

OPTEK evaluates all thermal management considerations including:

• Methods of removing heat
• Thermal equilibrium
• Analogy to electrical circuits
• Determining junction temperate from forward voltage
• Passive thermal management
• Active thermal management

Our Application Bulletin 228, Thermal Management of Visible LEDs, will give you in-depth answers on how to manage the junction temperature of high-power visible light emitting diodes. Click here to read or download the bulletin.

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